General introduction
This equipment is designed with core ultrasonic microscope, automatic loading，unloading and intelligent detection algorithm. Among them, the microscope uses multiple probes to scan multiple products in parallel. It can clearly display the structure of multiple layers on the surface and internal of the product at the same time. Moreover, it intelligently analyzes the image of each layer to automatically identify and locate the defect position. Common defects include voids, delamination, folds, cracks, etc. And the size and area of defects are counted, recorded, stored, and marked.
This equipment adopts the intelligent formula mode to manage the parameter configuration of different products (different size, different thickness). Moreover it realizes the functions of quick file building and one-key switching, and facilitates equipment operation . Void data (such as area, diameter, etc.) are calculated by visual algorithm . It accurately locates the defect position, and marks on the back of the defect chip. Thus users can accurately sort defect products. The equipment can automatically generate statistical reports, which is convenient for customers to carry out quality management and control.
Application
DBC Ceramic substrate, AMB Ceramic substrate，IC Packaging, SIN Ceramic substrate, SIC Ceramic substrate, Ceramic pipe fittings, IGBT module and other industries.
