| Availability: | |
|---|---|
| Quantity: | |
◇◇ Overview ◇◇
It provides reliable surface pretreatment for critical processes including printing, coating, lamination, and encapsulation, while addressing common issues like poor adhesion, uneven coating, and weak bonding. Furthermore, plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.
◇◇ Features ◇◇
The operating temperature is close to room temperature (usually < 50℃), and the processing time is short, effectively preventing the deformation or damage of heat-sensitive materials.
Capable of cleaning pollutants (≤0.1nm level) that are beyond the range of traditional wet cleaning methods.
Dry processing does not require chemical solvents, reducing waste liquid pollution; it supports inert or reactive gases, without toxic by-products.
Intelligent control and traceable production information.
◇◇ Technical Specifications ◇◇
Chamber capacity | 110L |
Electrode plate configuration | Vertical, 4 electrodes (the number of horizontal electrode layers or height can be adjusted arbitrarily) |
Loading tray size | 400mm(L)*473mm(W) |
Electrode fixing method | Plug-in detachable |
Electrode plate spacing | H: 54mm , 20mm, 184mm (suitable for different requirements) |
Equipment size | 900(W)×1100(D)×1750 (H)mm (excluding the height of tri-color light) |
Internal chamber size | 525(W)×445(D)×495(H)mm |
Equipment weight | 450KG |
Total power | 4.0KW |
◇◇ Application area ◇◇
Semiconductor packaging, 3C electronics, circuit board industry, biomedicine, new energy, military aviation.
◇◇ Overview ◇◇
It provides reliable surface pretreatment for critical processes including printing, coating, lamination, and encapsulation, while addressing common issues like poor adhesion, uneven coating, and weak bonding. Furthermore, plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.
◇◇ Features ◇◇
The operating temperature is close to room temperature (usually < 50℃), and the processing time is short, effectively preventing the deformation or damage of heat-sensitive materials.
Capable of cleaning pollutants (≤0.1nm level) that are beyond the range of traditional wet cleaning methods.
Dry processing does not require chemical solvents, reducing waste liquid pollution; it supports inert or reactive gases, without toxic by-products.
Intelligent control and traceable production information.
◇◇ Technical Specifications ◇◇
Chamber capacity | 110L |
Electrode plate configuration | Vertical, 4 electrodes (the number of horizontal electrode layers or height can be adjusted arbitrarily) |
Loading tray size | 400mm(L)*473mm(W) |
Electrode fixing method | Plug-in detachable |
Electrode plate spacing | H: 54mm , 20mm, 184mm (suitable for different requirements) |
Equipment size | 900(W)×1100(D)×1750 (H)mm (excluding the height of tri-color light) |
Internal chamber size | 525(W)×445(D)×495(H)mm |
Equipment weight | 450KG |
Total power | 4.0KW |
◇◇ Application area ◇◇
Semiconductor packaging, 3C electronics, circuit board industry, biomedicine, new energy, military aviation.