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In high-reliability fields such as aerospace, electronic components must endure extreme conditions including high temperatures, strong radiation, and long operational lifespans. Traditional PCB materials such as epoxy resin and fiberglass boards, although lightweight and cost-effective, often suffer from poor heat resistance, low radiation tolerance, and degradation over time. These limitations make them unsuitable for critical aerospace environments.
Advantages of AMB/DBC Ceramic Substrates
AMB/DBC ceramic substrates have become the preferred choice in aerospace applications due to their outstanding physical and electrical properties. Their key benefits include:
Stability in Extreme Conditions: With a breakdown voltage up to 20,000V, AMB/DBC substrates maintain stable performance across a temperature range of -196°C to 850°C. They also offer 20 times better radiation resistance, making them ideal for outer space environments.
Superior Thermal Conductivity: Aluminum nitride-based substrates provide thermal conductivity between 170 and 230 W/m·K, more than 50 times greater than traditional materials, enabling efficient heat dissipation for high-power devices.
Thermal Expansion Matching: Their thermal expansion coefficients align closely with materials like copper and titanium, ensuring strong metallurgical bonds and minimizing mechanical stress.
Excellent Compatibility with Semiconductor Chips: The structural match between the ceramic substrate and semiconductor devices helps prevent issues such as solder joint cracking, significantly improving reliability.
Low Dielectric Constant: These substrates are well-suited for high-frequency communication applications, minimizing signal loss and ensuring stable transmission.
Thanks to these advantages, ceramic substrates are widely adopted in satellites, radar systems, power control modules, and other mission-critical aerospace equipment.
Benefits of PTC's AMB/DBC Automatic Film Repairing Equipment
During the manufacturing process of ceramic substrates, the quality of the dry film layer plays a crucial role in determining electrical performance. To address issues such as copper exposure, voids, and dry film defects, PTC has developed an advanced AMB/DBC automatic film repairing equipment solution that integrates detection and repair into a single process. This automatic inspection equipment is designed to detect and repair film defects with high precision, helping manufacturers ensure stable product quality.
Key features include:
Automated Optical Inspection (AOI): The system automatically detects common defects such as dry film residue, copper exposure and voids. It then performs precise automated repairs, eliminating the requirement for manual intervention.
Full Automation: Capable of batch loading, dual-sided inspection, automated classification, and repair, the equipment can process both sides of the substrate in one operation, significantly increasing efficiency and consistency.
Data Management and Traceability: The system supports data query, export, and analysis functions, and can be seamlessly integrated with MES systems for complete quality traceability and process control.
High Compatibility and Flexibility: The equipment allows for customized templates and inspection parameters for different product models, making it adaptable to a wide range of production needs requiring high accuracy and yield.
PTC's automatic film repairing equipment plays a vital role in closing the quality assurance gap in high-end ceramic substrate manufacturing. By integrating inspection and repair, it enhances production efficiency and ensures consistent product performance, making it a key tool in supporting the intelligent, high-quality development of the aerospace electronics industry.
