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◇◇ Features ◇◇
The online continuous production enables seamless connection with preceding and subsequent processes, reducing manual handling, lowering costs, and error rates.
Vacuum conditions are highly controllable, and process parameters (air pressure, gas composition, power, etc.) are easy to precisely regulate and repeat, ensuring stability between batches.
High treatment uniformity: Well-designed electrode and chamber structures, combined with gas flow field control, enables uniform treatment of large-area and complex-shaped workpieces.
High reliability: With the industrial-grade design, high-quality products are selected for key components (such as vacuum pumps, radio frequency/ microwave generators, and matching devices) to ensure stability and reliability of long-term continuous operation.
Adaptability to complex workpieces: Through reasonably designed tooling fixtures and conveying systems, it can handle flat, 3D curved, and irregularly shaped workpieces.
Plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.
◇◇ Technical Specifications ◇◇
Product size | Length: 150-270mm, Width: 35-95mm |
Reaction chamber size | 320(W) × 610(D) × 50(H) mm |
Efficiency | 4 channels with 4 pieces, approx. 500 pcs/hour |
Plasma generator | Frequency 13.56MHz, adjustable power 0 - 600W with automatic impedance matching. |
Gas path system | The standard configuration includes 2 channels (O₂/Ar/H₂), controlled by mass flow meters, adjustable gas flow rate 0- 200ml/min. |
Control system | Touch screen + PLC full-auto control |
Equipment size | 2140 (W) × 1340 (D) × 1760 (H) mm |
◇◇ Application area ◇◇
Semiconductor IC field, medical treatment, printed circuit boards, automotive electronics, aerospace, etc
◇◇ Features ◇◇
The online continuous production enables seamless connection with preceding and subsequent processes, reducing manual handling, lowering costs, and error rates.
Vacuum conditions are highly controllable, and process parameters (air pressure, gas composition, power, etc.) are easy to precisely regulate and repeat, ensuring stability between batches.
High treatment uniformity: Well-designed electrode and chamber structures, combined with gas flow field control, enables uniform treatment of large-area and complex-shaped workpieces.
High reliability: With the industrial-grade design, high-quality products are selected for key components (such as vacuum pumps, radio frequency/ microwave generators, and matching devices) to ensure stability and reliability of long-term continuous operation.
Adaptability to complex workpieces: Through reasonably designed tooling fixtures and conveying systems, it can handle flat, 3D curved, and irregularly shaped workpieces.
Plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.
◇◇ Technical Specifications ◇◇
Product size | Length: 150-270mm, Width: 35-95mm |
Reaction chamber size | 320(W) × 610(D) × 50(H) mm |
Efficiency | 4 channels with 4 pieces, approx. 500 pcs/hour |
Plasma generator | Frequency 13.56MHz, adjustable power 0 - 600W with automatic impedance matching. |
Gas path system | The standard configuration includes 2 channels (O₂/Ar/H₂), controlled by mass flow meters, adjustable gas flow rate 0- 200ml/min. |
Control system | Touch screen + PLC full-auto control |
Equipment size | 2140 (W) × 1340 (D) × 1760 (H) mm |
◇◇ Application area ◇◇
Semiconductor IC field, medical treatment, printed circuit boards, automotive electronics, aerospace, etc