Ceramic substrates are a critical material in high-power electronics packaging, directly impacting device thermal management, electrical stability, and overall reliability. In sectors such as new energy vehicles, 5G communications, power electronics, and semiconductor lighting, direct bonded copper (DBC) ceramic substrates have become the material of choice for IGBT modules and other high-power packages due to their excellent thermal conductivity, high-temperature resistance, electrical insulation, and mechanical strength.
During fabrication and assembly, ceramic substrates frequently suffer defects such as insufficient via filling, cold solder joints, voids, copper depletion, and surface scratches. As integration levels rise and package structures become more complex, detecting these defects grows increasingly difficult. Traditional X-ray non-destructive testing can rapidly screen vias and solder joints, but two-dimensional imaging often suffers from image overlap and blind spots when inspecting multi-layer or high-precision packages. Industry data indicate that such undetected flaws can reduce packaging yield by 15–20%, leading to substantial financial losses. Introducing high-precision, intelligent automatic inspection equipment is therefore essential to improving yield and product reliability.
To address these challenges, PTC has developed a DBC defect automatic inspection equipment specifically designed to identify both common and subtle defects in ceramic substrates during the packaging process. Widely used in power semiconductor, new energy vehicle, and optoelectronic device production lines, this system efficiently detects issues such as copper voids, air bubbles, residual copper, scratches, misaligned cuts, poor plating, solder-mask defects, and oxidation—making it a vital tool for high-end ceramic packaging quality control.
PTC's DBC machine features a high-speed line-scan camera paired with a high-resolution lens to achieve both precise imaging and rapid inspection. A precision motion platform ensures image stability, while a multi-station optical system significantly reduces miss rates. The equipment supports both inline verification and workstation re-inspection modes, greatly enhancing defect confirmation efficiency. Its integrated software provides comprehensive data traceability and automated report generation to meet stringent process-control and traceability requirements.
As third-generation semiconductor materials such as GaN, SiC, and AlN drive ceramic substrates toward higher performance and greater integration, defect detection requirements become ever more demanding. PTC's DBC defect automatic inspection equipment not only overcomes the quality-monitoring challenges of modern packaging but also plays an indispensable role in ensuring product consistency and reliability—making it a cornerstone for the intelligent, high-quality development of the ceramic substrate industry.
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