Applicationem Plasma Cleaner in Processu Semiconductoris Packaging
| Pressura atmosphaerica Lata Lasma Plasma Lautus imprimis in campis adhibentur ut materias tenues pelliculas, textilia, IC subiecta, FP & PCB, materias compositas, et vitrum. | Vacuum Radio Frequentia (RF) Plasma Cleaner maxime applicatur in locis inter quas semiconductor Packaging, 3C Electronics, Biomedicus, Nova Energy, et Aerospace defensio. |
Vacuum Inline Plasma Lautus plerumque in campis adhibetur ut semiconductor IC, machinis medicae, PCB, electronicis autocineticis, et Aerospace. |
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