Applicationem Plasma Cleaner in Processu Semiconductoris Packaging
| Pressura atmosphaerica Lata Lasma Plasma Lautus imprimis adhibentur in campis ut materias tenues, textilia, IC subiecta, FP & PCB, materias compositas, et vitrum. | Vacuum Radio Frequentia (RF) Plasma Lautus maxime applicatur in locis inter quas Semiconductor Packaging, 3C Electronics, Biomedicus, Nova Energy, et Aerospace Defensio. |
Vacuum Inline Plasma Lautus plerumque in campis adhibetur ut semiconductor IC, machinis medicae, PCB, electronicis autocineticis, et Aerospace. |
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