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Scanning acoustic tomography instrument is designed with core acoustic microscope, automatic loading, unloading and intelligent inspection algorithm. Microscopium acusticum intuens multiplex rimatur ut multiplices fructus in parallelis scandat. Exhibere potest clare structuram multiplicium stratorum in superficie et interna producti simul.
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Overview
Features
Multi- proba parallela intuens, celeriter intuens celeritatem et efficientiam altam;
Praesto esse instructam machinae automatico oneratione et exoneratione, plenam processus automaticam perspicientes onerationis, scandendi, inspectionis et exonerandi;
Formulae intelligentes intuendi et inspectionis modum ad accommodandi formas diversorum generum cum specificationibus diversis;
Subtiliter imaginem inspectam analysi, defectus automatice colloca, ac producta NG notare vel qualia;
Praesto erit nativus et elaboratus ad mos requisita.
Scanning Acoustic Tomography SAT Technical Parameter |
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Vitia inspicienda |
bullae inter tunicas materiales; rimas, evacuat et delaminationem intra materiam |
Deprehensio rate |
≥99.9% (resolutio: 0.28mm) |
Deprehensio accurate |
minimum 0.1mm |
ENARRATIO celeritas |
1200mm/s |
Altiore magnitudine |
onerant et exonerant apparatus: 3550(L)*2570(W)*2000mm(H). inspectio unitatis: 1450(L)*1100(W)*1300mm(H) |
Altiore pondere |
de 2000Kg * |
Ratum initus voltage |
AC220V±5%, 50HZ±2% |
Ratum current |
20A |
Totalis potentia consummatio |
4.5KW |
1. Potestas Semiconductor Industry: Deprehendere et automatice notare evacuationes vel bullas in articulis variarum stratorum post fabricam fasciculi potentiae, ut simultaneum multi- strati inspectionem imaginandi efficiat.
2. Ceramica cuprea induta Industry substrato: Detegere evacuationes seu bullas ad commissuram cuprearum et ceramicarum in lamellis cupreis vestitis, cum latis oneratione et exoneratione ac duplicata exploratione.
3. Automotivi-gradus HPD Power Packaging Module: Deprehendere evacuationes vel bullas in connexione inter modulorum SiC et subiectorum, featuring automatic onerationem et exonerare, dual-probam intuens, et latae siccitatis.
4. Electronic Component Packaging Module: Deprehendere delaminationem in variis processibus packaging, utens summus solutionis rimatur et efficiens stratum latis fuco.
