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Scanning acoustic tomography equipment is designed with core acoustic microscope, automatic loading, unloading and intelligent inspection algorithm. The scanning acoustic microscope adopts multiple probes to scan multiple products in parallel. It can clearly display the structure of multiple layers on the surface and internal of the product at the same time.
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◇◇ Overview ◇◇
◇◇ Features ◇◇
Multi-probe parallel scanning, fast scanning speed and high efficiency;
Available to be equipped with automatic loading and unloading machine, realizing full automatic process of loading, scanning, inspection and unloading;
Intelligent formula scanning and inspection mode to adapt different types of products with different specifications;
Intelligently analyze the scanned image, automatically locate the defects, and mark or sort NG products;
Available to be customized and developed according to customer requirements.
Scanning Acoustic Tomography SAT Technical Parameter | |
Defects to be inspected | bubbles between material coatings; cracks, voids and delamination inside the material |
Detection rate | ≥99.9% ( resolution: 0.28mm) |
Detection accuracy | minimum 0.1mm |
Scanning speed | 1200mm/s |
Overall size | loading and unloading machine: 3550(L)*2570(W)*2000mm(H), inspection unit: 1450(L)*1100(W)*1300mm(H) |
Overall weight | about 2000Kg |
Rated input voltage | AC220V ±5%, 50HZ± 2% |
Rated current | 20A |
Total power consumption | ≦4.5KW |
1. Power Semiconductor Industry: Detect and automatically mark voids or bubbles at the joints of various layers after power device packaging, enabling simultaneous multi-layer imaging inspection.
2. Ceramic Copper-clad Substrate Industry: Detect voids or bubbles at the junction of copper and ceramic in copper-clad plates, with automatic loading and unloading and dual-probe scanning.
3. Automotive-grade HPD Power Packaging Module: Detect voids or bubbles at the connection between SiC modules and substrates, featuring automatic loading and unloading, dual-probe scanning, and automatic drying.
4. Electronic Component Packaging Module: Detect delamination in various packaging processes, using high-resolution probes and enabling automatic layer coloring.
◇◇ Overview ◇◇
◇◇ Features ◇◇
Multi-probe parallel scanning, fast scanning speed and high efficiency;
Available to be equipped with automatic loading and unloading machine, realizing full automatic process of loading, scanning, inspection and unloading;
Intelligent formula scanning and inspection mode to adapt different types of products with different specifications;
Intelligently analyze the scanned image, automatically locate the defects, and mark or sort NG products;
Available to be customized and developed according to customer requirements.
Scanning Acoustic Tomography SAT Technical Parameter | |
Defects to be inspected | bubbles between material coatings; cracks, voids and delamination inside the material |
Detection rate | ≥99.9% ( resolution: 0.28mm) |
Detection accuracy | minimum 0.1mm |
Scanning speed | 1200mm/s |
Overall size | loading and unloading machine: 3550(L)*2570(W)*2000mm(H), inspection unit: 1450(L)*1100(W)*1300mm(H) |
Overall weight | about 2000Kg |
Rated input voltage | AC220V ±5%, 50HZ± 2% |
Rated current | 20A |
Total power consumption | ≦4.5KW |
1. Power Semiconductor Industry: Detect and automatically mark voids or bubbles at the joints of various layers after power device packaging, enabling simultaneous multi-layer imaging inspection.
2. Ceramic Copper-clad Substrate Industry: Detect voids or bubbles at the junction of copper and ceramic in copper-clad plates, with automatic loading and unloading and dual-probe scanning.
3. Automotive-grade HPD Power Packaging Module: Detect voids or bubbles at the connection between SiC modules and substrates, featuring automatic loading and unloading, dual-probe scanning, and automatic drying.
4. Electronic Component Packaging Module: Detect delamination in various packaging processes, using high-resolution probes and enabling automatic layer coloring.
