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◇◇ Features ◇◇
Comprehensive detection capabilities: Supports multiple detection items, including hole area, dimensions, foreign object detection and others, meeting diverse customer needs.
Supports PCB industry common data formats: Gerber & ODB++, enabling offline drawing import to analysis electronic component elements. Component-specific inspection criteria can be configured .
German Basler high-speed, high-resolution industrial cameras: Equipped with high-brightness light sources, the equipment achieves high-speed flying shooting. Coupled with a unique multi-threaded synchronous processing algorithm, it enables more efficient image analysis and detection.
High precision moving units : Singapore Akribis high-precision magnetic levitation linear motors, UK Renishaw ultra-precision grating scales and Taiwan Hiwin high-precision linear guide;
Strong adaptability: Capable of inspecting stencils with various specifications, while a flexible recipe system is suitable for different industrial application scenarios.
The traceable detection data system facilitates reverse tracing of process defects and control of process standards.
User-friendly interface: The intuitive operation method and optimized software algorithm design make this defect detection system more convenient for operators to use the equipment.
◇◇ Technical Specifications ◇◇
| Detection unit | |
Application scenario | SMT steel stencil incoming inspection or inspection after cleaning |
Detection items | Hole area, position, offset, size, foreign object, burr, blocked hole, missing hole , tension, expansion and contraction |
Tension measurement: | Programmable digital tension meter with high precision, measuring range 5-60 N/cm. |
Frame size | 200*200*15~736*736*40(mm) |
Maximum detection area size | 620*620(mm) |
Detection speed | 0.7S per FOV. |
Min measureable single hole diameter | 20μm |
Max measureable single hole diameter | 9mm |
Min measureable hole spacing | 100μm |
System accuracy | |
Position measurement accuracy | 3.45μm(one pixel) |
Detection repetition accuracy | Gage R&R<3% |
| Moving position accuracy | Positioning accuracy:±3μm, repeating position accuracy : ±3μm |
Optical system | |
Camera | Basler 12 million pixels |
Lens | Double telecentric lens |
Pixel accuracy | 3.45μm |
FOV size | 14.13mm*10.35mm(optional) |
Top Illuminator | Coaxial light |
Bottom Illuminator | High-frequency strobe backlighting |
Software functions | |
Equipment testing mode | Offline testing |
Model number programming method | Off-line programming |
Main algorithm | Extract MARK correction to calculate coordinate position. Vector images algorithm is used to calculate the geometric position and size deviation between opening and actual Gerber |
Cam format | RS-274X, ODB++ |
User permission management | Supports hierarchical access control |
MES | Support customized development |
Steel stencil bar code management function | Optional, reserve software interface |
Graph comparison function | Support |
Information management system | Recipe system |
Historical record | The test process and result data are recorded in files, and the test results can be viewed offline |
Test method | Supports multiple detection modes and configurable test levels, enabling group-specific and level-specific test definition for different components |
SPC data statistics | Histogram, Xbar-R Chart, Cp&Cpk, Daily/Weekly/Monthly Report |
Equipment general specifications | |
Gantry structure | Dual-drive marble |
Dynamic system | Akribls magnetic levitation linear motor |
Computer system | Windows 10 22H2 Pro |
Industrial computer brand | Advantech |
Overall size | 1450mm*1350mm*1650mm (tri-color light height is not included) |
| Weight | About 1200KG |
◇◇ Application area ◇◇
BGA Bumping Process, SMT Precision Stencil, Wafer-Level Bumping Stencil , Quartz Photomask, Micro-electroforming stencil.
◇◇ Features ◇◇
Comprehensive detection capabilities: Supports multiple detection items, including hole area, dimensions, foreign object detection and others, meeting diverse customer needs.
Supports PCB industry common data formats: Gerber & ODB++, enabling offline drawing import to analysis electronic component elements. Component-specific inspection criteria can be configured .
German Basler high-speed, high-resolution industrial cameras: Equipped with high-brightness light sources, the equipment achieves high-speed flying shooting. Coupled with a unique multi-threaded synchronous processing algorithm, it enables more efficient image analysis and detection.
High precision moving units : Singapore Akribis high-precision magnetic levitation linear motors, UK Renishaw ultra-precision grating scales and Taiwan Hiwin high-precision linear guide;
Strong adaptability: Capable of inspecting stencils with various specifications, while a flexible recipe system is suitable for different industrial application scenarios.
The traceable detection data system facilitates reverse tracing of process defects and control of process standards.
User-friendly interface: The intuitive operation method and optimized software algorithm design make this defect detection system more convenient for operators to use the equipment.
◇◇ Technical Specifications ◇◇
| Detection unit | |
Application scenario | SMT steel stencil incoming inspection or inspection after cleaning |
Detection items | Hole area, position, offset, size, foreign object, burr, blocked hole, missing hole , tension, expansion and contraction |
Tension measurement: | Programmable digital tension meter with high precision, measuring range 5-60 N/cm. |
Frame size | 200*200*15~736*736*40(mm) |
Maximum detection area size | 620*620(mm) |
Detection speed | 0.7S per FOV. |
Min measureable single hole diameter | 20μm |
Max measureable single hole diameter | 9mm |
Min measureable hole spacing | 100μm |
System accuracy | |
Position measurement accuracy | 3.45μm(one pixel) |
Detection repetition accuracy | Gage R&R<3% |
| Moving position accuracy | Positioning accuracy:±3μm, repeating position accuracy : ±3μm |
Optical system | |
Camera | Basler 12 million pixels |
Lens | Double telecentric lens |
Pixel accuracy | 3.45μm |
FOV size | 14.13mm*10.35mm(optional) |
Top Illuminator | Coaxial light |
Bottom Illuminator | High-frequency strobe backlighting |
Software functions | |
Equipment testing mode | Offline testing |
Model number programming method | Off-line programming |
Main algorithm | Extract MARK correction to calculate coordinate position. Vector images algorithm is used to calculate the geometric position and size deviation between opening and actual Gerber |
Cam format | RS-274X, ODB++ |
User permission management | Supports hierarchical access control |
MES | Support customized development |
Steel stencil bar code management function | Optional, reserve software interface |
Graph comparison function | Support |
Information management system | Recipe system |
Historical record | The test process and result data are recorded in files, and the test results can be viewed offline |
Test method | Supports multiple detection modes and configurable test levels, enabling group-specific and level-specific test definition for different components |
SPC data statistics | Histogram, Xbar-R Chart, Cp&Cpk, Daily/Weekly/Monthly Report |
Equipment general specifications | |
Gantry structure | Dual-drive marble |
Dynamic system | Akribls magnetic levitation linear motor |
Computer system | Windows 10 22H2 Pro |
Industrial computer brand | Advantech |
Overall size | 1450mm*1350mm*1650mm (tri-color light height is not included) |
| Weight | About 1200KG |
◇◇ Application area ◇◇
BGA Bumping Process, SMT Precision Stencil, Wafer-Level Bumping Stencil , Quartz Photomask, Micro-electroforming stencil.