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◇◇ Overview ◇◇
This specialized system integrates a loading unit, AOI machine, unloading unit, and workstation to significantly enhance inspection efficiency. Featuring a dual-channel inspection mode, it enables fully automated one-stop operation, reducing production costs.
◇◇ Features ◇◇
Real-time Inspection & Results Display
Provides real-time monitoring of the inspection process
Displays final inspection results with visualization interface
Defect Detection & Analysis Module
Performs automatic defect identification and classification
Measures defect dimensions and provides coordinate positioning
Features defect extraction capability with complete image archiving
Production Data Statistics System
Automatically tracks production data, product information and batch details
Calculates production quantities and yield rates in real-time
Supports data storage, query functions and Excel format export
Data Management & System Integration
Integrated data query, export and analysis functions
User-friendly operation interface
MES system interface for seamless integration
Product Parameter Configuration
New product profile creation capability
Customizable inspection parameter templates
System Parameter Settings
Configurable system parameters with access control
Special function activation options are available with the Computerized Visual Inspection Equipment
Hardware parameter adjustment interface (light sources, cameras, etc.)
High-precision Auto-focus System
Proprietary auto-focus mechanism
Delivers high inspection accuracy
Equipment Efficiency
Standard inspection throughput: 80 pcs/hour
◇◇ Specifications ◇◇
Model No. | ME-EFD |
Inspection efficiency | 50S/PCS(Not include manual loading and unloading) |
Inspection product | AMB copper ceramic substrate , post-dicing and pre-singulation with cutting channels |
Inspection Item | Etching factor calculation formula: etching factor = copper thickness/copper length |
Detection rate | 99.9% |
Overkill rate | 5% |
Dimension | 3000mm(L) x 2000mm (W) x 2080mm (H) Dimension allowable tolerance: ±10% , not include tri-color light. |
◇◇ FAQ ◇◇
1. What is AMB ceramic substrate etching factor ?
The etching factor is a critical parameter that measures the precision and quality of the etching process, particularly in patterned substrates like those used in electronics. (e.g., PCB, AMB/LTCC/HTCC ceramics).
2. How to calculate AMB ceramic substrate etching factor ?
Definition: The etching factor quantifies the ratio of the depth of the etched feature (e.g., a trench or via) to the undercut (lateral etching).
It reflects how well the etching process maintains vertical sidewalls and avoids excessive sideways erosion.
Etching Factor=Undercut (u) / Depth of Etch (h)
3. Why does the etching factor matters in Ceramic Substrates ?
Performance Requirements
Poor etching factors can cause short circuits, impedance mismatches, or weak interconnects.
Design Impact
A low etching factor may force designers to increase feature spacing, limiting miniaturization.
◇◇ Overview ◇◇
This specialized system integrates a loading unit, AOI machine, unloading unit, and workstation to significantly enhance inspection efficiency. Featuring a dual-channel inspection mode, it enables fully automated one-stop operation, reducing production costs.
◇◇ Features ◇◇
Real-time Inspection & Results Display
Provides real-time monitoring of the inspection process
Displays final inspection results with visualization interface
Defect Detection & Analysis Module
Performs automatic defect identification and classification
Measures defect dimensions and provides coordinate positioning
Features defect extraction capability with complete image archiving
Production Data Statistics System
Automatically tracks production data, product information and batch details
Calculates production quantities and yield rates in real-time
Supports data storage, query functions and Excel format export
Data Management & System Integration
Integrated data query, export and analysis functions
User-friendly operation interface
MES system interface for seamless integration
Product Parameter Configuration
New product profile creation capability
Customizable inspection parameter templates
System Parameter Settings
Configurable system parameters with access control
Special function activation options are available with the Computerized Visual Inspection Equipment
Hardware parameter adjustment interface (light sources, cameras, etc.)
High-precision Auto-focus System
Proprietary auto-focus mechanism
Delivers high inspection accuracy
Equipment Efficiency
Standard inspection throughput: 80 pcs/hour
◇◇ Specifications ◇◇
Model No. | ME-EFD |
Inspection efficiency | 50S/PCS(Not include manual loading and unloading) |
Inspection product | AMB copper ceramic substrate , post-dicing and pre-singulation with cutting channels |
Inspection Item | Etching factor calculation formula: etching factor = copper thickness/copper length |
Detection rate | 99.9% |
Overkill rate | 5% |
Dimension | 3000mm(L) x 2000mm (W) x 2080mm (H) Dimension allowable tolerance: ±10% , not include tri-color light. |
◇◇ FAQ ◇◇
1. What is AMB ceramic substrate etching factor ?
The etching factor is a critical parameter that measures the precision and quality of the etching process, particularly in patterned substrates like those used in electronics. (e.g., PCB, AMB/LTCC/HTCC ceramics).
2. How to calculate AMB ceramic substrate etching factor ?
Definition: The etching factor quantifies the ratio of the depth of the etched feature (e.g., a trench or via) to the undercut (lateral etching).
It reflects how well the etching process maintains vertical sidewalls and avoids excessive sideways erosion.
Etching Factor=Undercut (u) / Depth of Etch (h)
3. Why does the etching factor matters in Ceramic Substrates ?
Performance Requirements
Poor etching factors can cause short circuits, impedance mismatches, or weak interconnects.
Design Impact
A low etching factor may force designers to increase feature spacing, limiting miniaturization.
