Scanning Acoustic Tomography

Name: Scanning Acoustic Tomography
Brand: Suzhou PTC Optical Instrument Co., Ltd.

Scanning acoustic tomography equipment is designed with core acoustic microscope, automatic loading, unloading and intelligent inspection algorithm. The scanning acoustic microscope adopts multiple probes to scan multiple products in parallel. It can clearly display the structure of multiple layers on the surface and internal of the product at the same time.

Moreover, scanning acoustic microscope is intelligently analyzes the image of each layer to automatically identify and locate the defect position. Common defects include voids, delamination, folds, cracks, etc. And the size and area of defects are counted, recorded, stored, and marked. Thus users can accurately sort defect products, and can automatically generate statistical reports, which is convenient for customers to carry out quality management and control.

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Video of PTC Scanning Acoustic Tomography

Features of Scanning Acoustic Tomography

Multi-probe parallel scanning, fast scanning speed and high efficiency;
Available to be equipped with automatic loading and unloading machine, realizing full automatic process of loading, scanning, inspection and unloading;
Intelligent formula scanning and inspection mode to adapt different types of products with different specifications;
Intelligently analyze the scanned image, automatically locate the defects, and mark or sort NG products;
Available to be customized and developed according to customer requirements.

Specifications

Scanning Acoustic Tomography SAT Technical Parameter
Defects to be inspected	bubbles between material coatings; cracks, voids and delamination inside the material
Detection rate	≥99.9% ( resolution: 0.28mm)
Detection accuracy	minimum 0.1mm
Scanning speed	1200mm/s
Overall size	loading and unloading machine: 3550(L)2570(W)2000mm(H), inspection unit: 1450(L)1100(W)1300mm(H)
Overall weight	about 2000Kg
Rated input voltage	AC220V ±5%, 50HZ± 2%
Rated current	20A
Total power consumption	≦4.5KW

Scanning Acoustic Tomography SAT Application

1. Power Semiconductor Industry: Detect and automatically mark voids or bubbles at the joints of various layers after power device packaging, enabling simultaneous multi-layer imaging inspection.

2. Ceramic Copper-clad Substrate Industry: Detect voids or bubbles at the junction of copper and ceramic in copper-clad plates, with automatic loading and unloading and dual-probe scanning.

3. Automotive-grade HPD Power Packaging Module: Detect voids or bubbles at the connection between SiC modules and substrates, featuring automatic loading and unloading, dual-probe scanning, and automatic drying.

4. Electronic Component Packaging Module: Detect delamination in various packaging processes, using high-resolution probes and enabling automatic layer coloring.