Description of Semiconductor Equipment
PTC’s Semiconductor Equipment combines advanced technology with intelligent control systems, offering high-precision solutions for wafer fabrication to chip packaging, ensuring accuracy, efficiency, and reliability across various industries.
Advanced technology integration
High-precision control systems
Real-time performance monitoring
Smart factory compatibility
Versatile applications: Consumer electronics, automotive, sensors, aerospace
Optimized for both small-batch and mass production
Composition of Semiconductor Equipment
- Advanced industrial computer for seamless operation- User-friendly touchscreen interface- Multiple interface options for flexibility
-High-precision imported linear guides-Powerful servo motors AND drivers FOR smooth movement-Anti-Rigid machine frame FOR enhanced stability
-High-efficiency laser source FOR precise cutting-Stable POWER output FOR consistent performance-Low-maintenance,durable design
- Precision wafer loading and unloading system- Automated handling to reduce downtime- Compatible with a wide range of wafer sizes
Representative Products
Cosmetic Defect Inspection Equipment
Product Dimensions: Length: 100–194 mm, Width: 100–142 mm, Thickness: ≤ 0.635 mm Defect Types: Contamination, spot, chip, protrusion, micro-crack, hole, surface mark Cycle Time: 6s/pcs Power Consumption: 6KW Voltage: 220VAC Continuous Operation: Supports non-stop loading and unloading
Scanning Acoustic Tomography
Defects Detected: Voids, delamination, cracks, folds Detection Rate: ≥99.9% (resolution: 0.28mm) Scanning Speed: 1200mm/s Detection Accuracy: Minimum 0.1mm Power Consumption: ≦4.5KW Overall Size: Loading/unloading machine: 3550(L) x 2570(W) x 2000(H), Inspection unit: 1450(L) x 1100(W) x 1300(H)
High Voltage Testing Equipment
Voltage: 380V Cycle Time: 12s/pcs (30s testing), 14.5s/pcs (60s testing) Power Consumption: 9KW Air Pressure: 0.6Mpa Overall Size: 4200mm(L) x 1800mm(W) x 2100mm(H)
