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PTC-CCP-40L
PTC
◇◇ Features ◇◇
The online continuous production enables seamless connection with preceding and subsequent processes, reducing manual handling, lowering costs, and error rates.
Vacuum conditions are highly controllable, and process parameters (air pressure, gas composition, power, etc.) are easy to precisely regulate and repeat, ensuring stability between batches.
High treatment uniformity: Well-designed electrode and chamber structures, combined with gas flow field control, enables uniform treatment of large-area and complex-shaped workpieces.
High reliability: With the industrial-grade design, high-quality products are selected for key components (such as vacuum pumps, radio frequency/ microwave generators, and matching devices) to ensure stability and reliability of long-term continuous operation.
Adaptability to complex workpieces: Through reasonably designed tooling fixtures and conveying systems, it can handle flat, 3D curved, and irregularly shaped workpieces.
Plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.
◇◇ Technical Specifications ◇◇
Product size | Length: 150-270mm, Width: 35-95mm |
Reaction chamber size | 610*320*47mm |
Efficiency | 4 channels with 4 pieces, approx. 500 pcs/hour |
Plasma generator | Frequency 13.56MHz ± 0.05%, adjustable power 0 - 1000W with automatic impedance matching. |
Gas path system | The standard configuration includes 2 channels (O₂/Ar/H₂/N2), controlled by mass flow meters, adjustable gas flow rate 0- 300ml/min. |
| Vacuum pump | Dry pump / Oil pump |
| Pumping speed | 60m³/h |
| Ultimate vacuum degree | ≤5Pa |
| Operating vacuum range | 10-150Pa |
| Evacuation time | ≤ 40 s |
| Vacuum break time | ≤ 15 s |
Control system | Touch screen + PLC full-auto control |
| Equipment size | 2100 (W) × 1300 (D) × 1800 (H) mm |
| Weight | About 2000KG |
◇◇ Application area ◇◇
This plasma cleaning machine is applicable to the following areas:
· Printed Circuit Board (PCB) industry – surface activation of high‑frequency boards; surface cleaning and desmearing of multilayer boards; surface cleaning and desmearing of flexible and rigid‑flex boards; and activation prior to stiffener application on flexible boards.
· Semiconductor IC field – processes including COB, COG, COF, ACF, SOT, SIP, and SOP, for cleaning before wire bonding and soldering.
· Silicone, plastic, and polymer sector – surface roughening, etching, and activation of silicone, plastic, and polymer materials.