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PTC-CCP110
PTC
◇◇ Overview ◇◇
It provides reliable surface pretreatment for critical processes including printing, coating, lamination, and encapsulation, while addressing common issues like poor adhesion, uneven coating, and weak bonding. Furthermore, plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.
◇◇ Composition ◇◇
Mainly composed of vacuum chamber, electrode plates, radio frequency (RF) power supply, matcher, and vacuum pump.
◇◇ Features ◇◇
Low-temperature & fast processing: Operates near room temperature (<50°C) with short cycle times, preventing damage to heat-sensitive materials.
Superior cleaning: Removes contaminants at the level≤0.1nm, surpassing the limits of traditional wet cleaning methods.
Eco-friendly & dry process: Eliminates chemical solvents and wastewater; uses inert/reactive gases without generating toxic by-products.
Intelligent & traceable: Features smart process control with full production data traceability.
◇◇ Process perfomance ◇◇


before treatment , contact angle = 85.6° after treatment , contact angle = 14.3°
◇◇ Technical Specifications ◇◇
Chamber capacity | 110L |
| Chamber size | 525(W)×445(D)×495(H)mm |
| Power range | Continuously adjustable from 0-600W, precision ±1% |
| Radio frequency | 13.56MHz ± 0.05% |
| Processing speed | 3~10 minutes (subject to processing performance) |
| Post-processing performance | Water contact angle< 15° |
| Matching method | Automatic impedance matching network |
| Electrode type | Parallel plate capacitive coupling |
| Electrode material | Anodized aluminum |
Electrode plate configuration | Horizontal, 4 electrodes (the number of horizontal electrode layers or height can be adjusted) Cassette loading is available |
Electrode fixing method | Plug-in detachable |
Vacuum pump | Rotary vane mechanical pump |
Pumping speed | 60m³/h |
Ultimate vacuum degree | ≤5Pa |
Operating vacuum range | 10-100Pa |
Channel number of process gas | Standard 2 channels. Multiple channels are optional |
| Gas types | Ar, O₂, N₂, H₂. Corrosive gas CF₄ is Optional |
| Gas control method | Mass Flow Controller (MFC) |
| MFC measurement range and accuracy | 0-300 sccm, accuracy ±2% F.S |
| Loading tray size | 400mm(L)*473mm(W) |
| Equipment size | 900(W)×1100(D)×1750 (H)mm (excluding the height of tri-color light) |
| Equipment weight | About 450KG |
◇◇ Application area ◇◇
Semiconductor packaging (de-gluing, surface activation), LED chip manufacturing, 3C electronics, Circuit Board, Biomedicine, New energy, Military aviation.