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Vacuum Radio Frequency Plasma Cleaning Equipment

Plasma cleaning equipment prepares product surfaces through activation, cleaning, etching, and photoresist removal. This process enhances surface wettability, improves adhesion for coating, plating, and bonding operations, and effectively removes contaminants such as oils and organic residues.
 
 
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  • PTC-CCP110

  • PTC



◇◇ Overview ◇◇


 It provides reliable surface pretreatment for critical processes including printing, coating, lamination, and encapsulation, while addressing common issues like poor adhesion, uneven coating, and weak bonding. Furthermore, plasma cleaning offers an eco-friendly, efficient, and controllable dry alternative to traditional solvent-based cleaning methods.


  ◇◇ Composition ◇◇


Mainly composed of vacuum chamber, electrode plates, radio frequency (RF) power supply, matcher, and vacuum pump.



◇◇ Features ◇◇


  • Low-temperature & fast processing: Operates near room temperature (<50°C) with short cycle times, preventing damage to heat-sensitive materials.

  • Superior cleaning: Removes contaminants at the level≤0.1nm, surpassing the limits of traditional wet cleaning methods.

  • Eco-friendly & dry process: Eliminates chemical solvents and wastewater; uses inert/reactive gases without generating toxic by-products.

  • Intelligent & traceable: Features smart process control with full production data traceability.


           ◇◇ Process perfomance ◇◇


                             001002



                                     before treatment , contact angle = 85.6°      after treatment , contact angle = 14.3°




◇◇ Technical Specifications ◇◇


Chamber capacity

110L

Chamber size  525(W)×445(D)×495(H)mm
Power range Continuously adjustable from 0-600W, precision ±1%
Radio frequency 13.56MHz ± 0.05%
Processing speed 3~10 minutes (subject to processing performance)
Post-processing performance Water contact angle< 15°
Matching method Automatic impedance matching network
Electrode type Parallel plate capacitive coupling
Electrode material Anodized aluminum

Electrode plate configuration

Horizontal, 4 electrodes (the number of horizontal electrode layers or height can be adjusted)

Cassette loading is available

Electrode fixing method

Plug-in detachable

Vacuum pump

Rotary vane mechanical pump

Pumping speed

60m³/h

Ultimate vacuum degree

≤5Pa

Operating vacuum range

10-100Pa

Channel number of process gas

Standard 2 channels. Multiple channels are optional

Gas types Ar, O₂, N₂, H₂. Corrosive gas CF₄ is Optional
Gas control method Mass Flow Controller (MFC)
MFC measurement range and accuracy 0-300 sccm, accuracy ±2% F.S
Loading tray size 400mm(L)*473mm(W)
Equipment size 900(W)×1100(D)×1750 (H)mm (excluding the height of tri-color light)
Equipment weight About 450KG



◇◇ Application area ◇◇

2




Semiconductor packaging (de-gluing, surface activation), LED chip manufacturing, 3C electronics, Circuit Board, Biomedicine, New energy, Military aviation.



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Contact Info

Telephone: +86-512-5792-5888
 Email: sales@ptcstress.com
 Address: No.581, Hengchangjing Road, Zhoushi Town, Kunshan City, Jiangsu Province, 215337, China

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