Water-cooled Plasma Cleaning Equipment

◇◇ Featured Application ◇◇

• Desmearing for multilayer flexible boards, rigid-flex boards, and FR-4 high aspect ratio micro-holes:

  Improves the bonding force between the hole wall and the copper plating layer, ensures thorough desmearing,                  enhances the reliability of continuity, and prevents open circuits in the inner layer after copper plating.

• Surface modification and activation of PTFE (Teflon) high-frequency microwave board hole walls before electroless copper plating:

  Improves the bonding force between the hole wall and the copper plating layer, eliminating issues like black holes             and blowholes. Board surface activation before solder mask and legend printing: Effectively prevents the peeling of           solder mask and legend ink.

• Removal of laser ablation residues in through-holes, blind/buried vias of HDI boards:

        Not restricted by hole diameter; the effect is even more pronounced for micro-vias smaller than 50μm (Micro-via                hole, IVH, BVH).

• Removal of dry film residues during fine-line circuit fabrication.

• PI surface roughening before rigid-flex board lamination and before flexible board reinforcement:

        Can increase peel strength by more than 10 times.

• Surface cleaning of fingers and pads before Electroless gold or Electroplating gold: Removes contaminants like solder mask ink, improving adhesion and reliability. Some large flexible board factories have replaced traditional mechanical brushing machines with cold plasma treatment for pre-Electroless gold/plating gold cleaning.

• Surface cleaning of pads before SMT assembly, after Electroless gold / Electroplating gold:

         Improves solderability, prevents cold solder joints and poor tinning, and enhances strength and reliability

◇◇ Features ◇◇

• Optimized gas flow design: Utilizes a top gas inlet and bottom exhaust method to ensure uniform distribution of the process gas.

• Precise electrode plate construction: The electrode plate is made from a solid aluminum block with a hollowed-out center. Cooling channels are created using deep-drilling techniques combined with internal flow restriction at specific locations, guiding the cooling water in a defined path to ensure temperature uniformity.

• Integrated heating & cooling unit: This plasma cleaner employs an integrated heating and cooling unit. Chilled water supplies the power supply and vacuum pump, while temperature-controlled water is supplied to the electrode plate to maintain stable temperatures and enhance treatment effectiveness.

• Comprehensive safety protection system: Includes safety features such as protection against water shortage, gas deficiency, low voltage, and electrical circuit faults.

  
  

  
  

◇◇ Technical Specifications ◇◇

◇◇ Application area ◇◇

It is primarily used in the printed circuit board industry, including PCBs, HDI, and other related technologies